The amount of electronic waste has nearly doubled since 2010 – a worrying trend for all industries t...
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In the rapidly evolving landscape of industrial applications, Artificial Intelligence (AI) is emergi...
As a young boy in hospital with appendicitis, I was fascinated when the doctor pressed an ultrasound...
In an increasingly connected world, cyber security is no longer optional. It’s essential. For indust...
Current knowledge is that fast and reliable Time-Sensitive Networking (TSN) requires wired Ethernet ...
Benchmarking the AI performance of different typesof AI hardware can feel like comparing apples to o...
Growing up, I loved building Lego. I’d spend hours making contraptions that could do it all—fly, swi...
With the release of Rev. 1.2 of the COM-HPC base specification and the introduction of the Mini size...
Have you ever considered creating a modular FPGA-accelerated design with all the necessary bells and...
The new PlayStation 5 Pro has caused a stir in the gaming world, particularly due to its improved GP...
Rethinking Sustainability – How COM Designs Extend Lifecycles and Conserve Resources
The amount of electronic waste has nearly doubled since 2010 – a worrying trend for all industries...
Industrial vision AI: Are you prepared for it?
In the rapidly evolving landscape of industrial applications, Artificial Intelligence (AI) is...
I see what you don't see - AI is revolutionizing ultrasound diagnostics
As a young boy in hospital with appendicitis, I was fascinated when the doctor pressed an...
Lifting the Fog: The EU Cyber Resilience Act and its Impact on Embedded Systems
In an increasingly connected world, cyber security is no longer optional. It’s essential. For...
The Wireless Revolution Reshaping Smart Factories: TSN Without the Cables
Current knowledge is that fast and reliable Time-Sensitive Networking (TSN) requires wired Ethernet...
Decoding AI Hardware Performance: Usable Metrics Beyond TOPs
Benchmarking the AI performance of different typesof AI hardware can feel like comparing apples to...
Building More with Less: Applying Lego Logic to Embedded System Consolidation
Growing up, I loved building Lego. I’d spend hours making contraptions that could do it all—fly,...
COM-HPC Mini - Part 4: The Connector
With the release of Rev. 1.2 of the COM-HPC base specification and the introduction of the Mini...
Scalable and modular – but can it be software-defined?
Have you ever considered creating a modular FPGA-accelerated design with all the necessary bells...
Unleash PS5 Pro-like Performance in Your Embedded Systems
The new PlayStation 5 Pro has caused a stir in the gaming world, particularly due to its improved...
