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COM-HPC Mini - Part 2: The Pinout

As described in the previous blog of this series, the COM-HPC specification now defines a smaller COM-HPC Mini size. The trade off for this shrink is the use of a single 400-pin connector, half the pin count of COM-HPC Client. The pinout was adjusted for the Mini to maintain a maximum of interfaces for low power implementations. 

Mini Pinout

Despite having a lower pin count compared to COM Express Type 6, the COM-HPC Mini boasts a rich feature set that includes the latest I/Os like USB4 and SoundWire. It also offers more Ethernet ports, with 2x NBaseT and 2x RGMII shared with PCIe lanes. For connecting mass storage devices, the almost legacy SATA interface is still supported, also sharing PCIe lanes. However, most applications will likely utilize the much faster NVME interface via dedicated PCIe lanes. 

To enable the greatest flexibility while conserving pins, 8 high-speed data lanes are shared among DDI (Digital Display Interface), USB 3.x, and USB4. The specification document defines the following standard sharing combinations to reach maximum interoperability: 

SS Lanes

Config 1

Config 2

Config 3

Config 4

Config 5

 

SS Lane 0

1st DDI

1st DDI

1st DDI

3rd USB4

3rd USB4

 

SS Lane 1

 

SS Lane 2

2nd DDI

1st USB4

1st USB4

1st USB4

1st USB4

 

SS Lane 3

 

SS Lane 4

4th USB 3.x

4th USB 3.x

2nd USB4

2nd USB4

2nd USB4

 

SS Lane 5

3rd USB 3.x

3rd USB 3.x

 

SS Lane 6

2nd USB 3.x

2nd USB 3.x

2nd USB 3.x

2nd USB 3.x

4th USB4  

SS Lane 7

1st USB 3.x

1st USB 3.x

1st USB 3.x

1st USB 3.x

 

 

In my next post I will go to the next level and talk about the optimized cooling solutions for COM-HPC Mini. So stay cool and stay tuned... 

Christian Eder-PICMG frei

 


Posted by Christian Eder

Christian Eder is a cofounder of congatec and serves as Director Market Intelligence. Christian – with his 30 years of experience in embedded computing – is the chairman of PICMG’s COM-HPC workgroup. He is also active in a number of other PICMG working groups and has served as an editor for the following specifications: COM Express 2.0, COM Express 2.1, COM Express Design Guide, Embedded EEPROM, Embedded EAPI, and COM Express 3.0. Christian is also board member of the SGET and editor of the SMARC 2.0 and 2.1 specifications. He holds a degree in Electrical Engineering from the University of Applied Sciences Regensburg, Germany.